Standard 4 Layer Construction (0.062″)

Layer 1	Copper	0.5 oz foil plated to approximate* thickness 0.0017″ (+/-0.0004″)
	Bonding Ply (1×7628, 3×1080)	Thickness 0.0141″ (+/-0.001″) Dielectric Constant 4.5 (+/-0.10)
Layer 2	Copper	1 oz foil thickness 0.0014″ (+/-0.0004″)
	Laminate Core	Thickness 0.028″ (+/- 0.0025″) Dielectric Constant 4.5 (+/-0.10)
Layer 3	Copper	1 oz foil thickness 0.0014″ (+/- 0.0004″)
	Bonding Ply (1×7628, 2×1080)	Thickness 0.0141″ (+/- 0.001″) Dielectric Constant 4.5 (+/- 0.0004″)
Layer 4	Copper	0.5 oz foil plated to approximate* thickness 0.0017″ (+/-0.0004″)

Total Thickness       0.0621″ (+/-0.0061″)

*Plating target is minimum of 0.0008″ in the hole with approximately 0.001″ on the surface.  Design can influence the plated thickness. Generally thinner on planes and thicker on signals.